170 lines
4.8 KiB
Markdown
170 lines
4.8 KiB
Markdown
# MeshPoE-S3
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**Project Name:** MeshPoE-S3
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**Author:** Nickie Deuxyeux
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**Date:** 2026-03-18
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**License:** Creative Commons (CC BY)
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---
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## Description
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The MeshPoE-S3 is a universal mesh node designed for use in LoRA mesh networks such as **Reticulum**, **Meshtastic**, and **MeshCore**.
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It is mostly designed for stationary deployment and PoE power.
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- Based on the [WaveShare ESP32-S3 ETH Development Board](https://www.waveshare.com/esp32-s3-eth.htm)
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- LoRA modules: [EByte E22-series](https://www.cdebyte.com/products/E22-900M30S)
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Key features:
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- Compact form factor** suitable for outdoor mesh nodes
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- Power-over-Ethernet (PoE)** support for convenient outdoor or roof deployment
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- Ethernet connectivity** for reliable wired networking
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- GPIO headers** for easy customization and expandability
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- Optional **DS3231MZ+ RTC** for timekeeping
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- Optional **I2C** environment sensor support (BME280, BME680, etc)
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This repository contains the KiCad project files, PCB schematics, board images, Gerbers for fabrication.
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You are welcome to alter the design to fit your requirements.
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---
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## Project Structure
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```
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MeshPoE-S3/
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├── KiCad/
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│ ├── MeshPoE-S3.kicad_pcb # PCB layout
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│ ├── MeshPoE-S3.kicad_prl # PCB plot file
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│ ├── MeshPoE-S3.kicad_pro # Project file
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│ └── MeshPoE-S3.kicad_sch # Schematic
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├── Images/
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│ ├── MeshPoE-S3-Front.png # Front layer image
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│ ├── MeshPoE-S3-Back.png # Back layer image
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│ └── MeshPoE-S3-Schematic.png # Schematic overview
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├── Gerbers/
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│ └── Gerbers-MeshPoE-S3.zip # Exported Gerbers for fabrication
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└── README.md # This file
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```
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## Images
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<table>
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<tr>
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<td align="center">
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<img src="Images/MeshPoE-S3-Front.png" alt="Front View" width="300"/>
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</td>
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<td align="center">
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<img src="Images/MeshPoE-S3-Back.png" alt="Back View" width="300"/>
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</td>
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</tr>
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<tr>
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<td align="center">Front View</td>
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<td align="center">Back View</td>
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</tr>
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</table>
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## Pin Assignments
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<table>
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<tr>
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<td align="center">LoRa Module</td>
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<td align="center">I2C</td>
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<td align="center">Other</td>
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</tr>
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<tr>
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<td valign="top">
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| Signal | GPIO |
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|---------------|------|
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| CS(NSS) | 16 |
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| SCLK(SCK) | 18 |
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| MISO | 3 |
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| MOSI | 15 |
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| BUSY | 1 |
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| RST | 2 |
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| DIO(IRQ) | 0 |
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| TXEN | 34 |
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| RXEN | 35 |
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</td>
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<td valign="top">
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| Signal | GPIO |
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|---------------|------|
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| SCL | 17 |
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| SDA | 21 |
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</td>
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<td valign="top">
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| Function | GPIO |
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|---------------|------|
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| User Button | 36 |
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</td>
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</tr>
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</tr>
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</table>
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## Schematic
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## Bill Of Materials
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<table>
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<tr>
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<td align="center">🔳Modules</td>
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<td align="center">⚡Capacitors</td>
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</tr>
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<tr>
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<td valign="top">
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| Ref | Qty | Part | Description / Notes | Footprint |
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| ------------- | --- | ------------- | ------------------------------- | ------------ |
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| U1 | 1 | ESP32-S3-ETH | MCU module | ESP32-S3-ETH |
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| U2 | 1 | E22-900M30S | LoRa module | E22-900M30S |
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| U3 | 1 | DS3231MZ+ | RTC | SOIC-8 |
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| SSD1306 OLED | 1 | | OLED display | HN1x4 |
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</td>
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<td valign="top">
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| Ref | Qty | Value | Notes | Footprint |
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| ----------------- | --- | -------------- | ---------------------------- | --------- |
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| C1,C2,C4,C5,C6,C9 | 2 | 100nF | Decoupling | 1206 |
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| C3 | 1 | 470nF | Bulk | 1206 |
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| C7,C8 | 2 | TMCMB1C476MTRF | 47µF tantalum/polymer | 1206 |
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</td>
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</tr>
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</tr>
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</table>
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<table>
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<tr>
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<td align="center">🧲Inductors</td>
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<td align="center">🔩Resistors</td>
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<td align="center">🔘Switches</td>
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<td align="center">🔗Connectors</td>
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</tr>
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<tr>
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<td valign="top">
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| Ref | Qty | Value | Footprint |
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| --- | --- | ----- | --------- |
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| L1 | 1 | 15µH | 1210 |
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</td>
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<td valign="top">
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| Ref | Qty | Value | Footprint |
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| --- | --- | ----- | --------- |
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| R1 | 1 | 10k | 1206 |
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</td>
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<td valign="top">
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| Ref | Qty | Part | Footprint |
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| --- | --- | ---------------- | ---------- |
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| S1 | 1 | SPST Push Button | 6x6x5mm |
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</td>
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<td valign="top">
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| Ref | Qty | Part | Description |
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| ------ | --- | ----------- | ---------------------- |
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| J1, J2 | 2 | 61302011821 | 1x20 2.54mm pin header |
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</td>
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</tr>
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</tr>
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</table>
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## License
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This project is licensed under **Creative Commons Attribution (CC BY)**. You may share and adapt the material as long as appropriate credit is given. |